Thermal Management

Reliable Performance Is Critical

Dissipate heat in electronic devices with thermally conductive adhesive transfer tapes as you also simplify assembly, helping cut costs while enhancing performance and minimizing reliability concerns.

Strouse engineers not only guide you to the right material selection from 3M and other leading manufacturers, they’ll help you design a component that can be easily integrated with your assembly process.

THERMALLY CONDUCTIVE ADHESIVE TRANSFER TAPES

These thin tapes provide efficient thermal transfer for many applications: bonding heat sinks, heat spreaders, power transistors, and other heat generating components. Expect high-performance acrylic adhesive with highly conductive ceramic particles.

Transfer Tapes The 3M Advantage

THERMALLY CONDUCTIVE INTERFACE PADS

These soft and conformable pads provide high levels of conductivity for demanding electronics industry applications. Available in silicone and non-silicone elastomers, pads are easy to handle and can be die cut to fit nearly any application.

Thermal Interface Materials The 3M Advantage

THERMALLY CONDUCTIVE EPOXIES

Enjoy less odor and good structural strength adhesion with these reliable liquid adhesives that flow and fill micro-spaces on surfaces. Dispensing is easy for both manual application and high output, in-line automated manufacturing.

Foil Adhesive The 3M Advantage

THERMALLY CONDUCTIVE GREASES

These high performance thermal interface materials transfer thermal energy from a heat source to a heat sink. Inorganic fillers are blended with an organic matrix (non-silicone) to ensure high thermal conductivity. Choose standard viscosity or lower viscosity.

Thermal Interface Materials The 3M Advantage

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BruceProduct Marketing Manager, Fujitsu Components America

THERMAL MANAGEMENT

Reliable Performance Is Critical

If You’re Unsure What Type of Thermal Management Solution to Use for Your Application